Automotive-grade product offers a reliable, repeatable and versatile solution that can be scaled up in line with specific customer requirements
SINGAPORE, Nov. 22, 2022 /PRNewswire/ — Interplex, a world leader in designing and manufacturing interconnect and mechanical products, is successfully addressing the growing market demand for high-density interconnects in challenging application scenarios. The company has just released its Multi-Row Board-to-Board (BTB) connector product.
Multi-Row Board-to-Board Connector
Thanks to the proprietary snap-in biscuit design, this ingenious interconnect concept will disrupt the industry – allowing multiple connector units to be stacked together. This means interconnections can be appropriately sized while avoiding the need for them to be custom built. The unique cost-effective approach which Interplex has taken will enable different pin count requirements to be attended to via the same basic interconnect platform, without any extra expense or engineering effort.
The new Multi-Row BTB connectors feature 0.4mm miniPLX™ press-fit pins, so the need for soldering is eliminated. These pins are made from a copper alloy and exhibit very low levels of contact resistance (