HONG KONG — Chinese automotive chipmaker SiEngine Technology this week said it completed a 500 million yuan ($72.5 million) Series A+ funding round in the fourth quarter of last year.
The round, whose participants included Teda Venture Capital, Haier Capital, SPDB International Holdings, Wuhan S&T Investment Company and Tongxi Capital, will help boost chip output among other uses. Existing shareholders Grandsyn Capital, Yuexiu Fund and Vision Knight Capital also took part in the funding.