LG Innotek has announced its all-new electronic component for vehicles, the Automotive Application Processor Module (AP Module), as it targets automotive semiconductor component markets worldwide. Through this move, the LG Electronics subsidiary will enable the company to expand its existing electronic components business into the automotive semiconductor sector.
Detailing the motivations behind the move, LG Innotek highlighted the heightened demand for AP modules, which is today growing alongside advancements made in connected cars. At the same time, it cited the limitations of the Printed Circuit Board (PCB)-based semiconductor chips used in today’s vehicles, which it says are unable to efficiently process the large quantities of data generated by contemporary digital cockpits (from functions including advanced ADAS and high-resolution displays).
A key highlight of LG Innotek’s new AP module is its form factor, measuring 2.5 inches x 2.5 inches (6.35 cm x 6.35 cm). It contains more than 400 components, including a memory semiconductor, a Power Management Integrated Circuit (PMIC), and an integrated chipset that controls various systems such as data and graphics processing, display output, and multimedia.
In applying this product, LG Innotek says that the size of existing motherboards can be shrunk, helping customers enhance design flexibility. It also shortens the signal distance between the highly integrated components in the module, further improving the module’s control performance.
Following its rollout, LG Innotek will continue to enhance the Automotive AP Module. In 2025, it is aiming to increase the module’s heat dissipation performance, enabling it to operate at up to 95°C (203°F), and shorten its development period by predicting warpage through virtual simulation. Today, the company is promoting the product to global semiconductor companies in North America and other regions, with plans for it to enter mass production in the second half of the year.