The Government of India has approved the first tranche of seven projects under the Electronics Components Manufacturing Scheme (ECMS), marking a significant advancement in the country’s electronics manufacturing capabilities.
Union Electronics and IT Minister Ashwini Vaishnaw announced the approvals, stating that the projects represent a combined investment of ₹5,532 crore and are expected to generate production valued at ₹36,559 crore while creating more than 5,100 direct jobs.
The approved manufacturing units will produce multi-layer Printed Circuit Boards (PCBs), High-Density Interconnect (HDI) PCBs, camera modules, copper clad laminates, and polypropylene films. These components are essential for smartphones, laptops, automotive systems, drones, medical instruments, and industrial equipment.
Geographic Distribution and Production Targets
The seven projects are distributed across three states: five units in Tamil Nadu, one in Andhra Pradesh, and one in Madhya Pradesh. This distribution reflects the government’s approach to balanced regional development in high-tech manufacturing.
According to Vaishnaw, the new facilities will meet 100 percent of domestic demand for copper clad laminates, 20 percent of PCB requirements, and 15 percent of camera module sub-assembly needs. Additionally, 60 percent of the total production is planned for export markets.
Industry Response and Investment Pipeline
The ECMS has attracted substantial interest from both domestic and international manufacturers. The scheme has received 249 applications representing a total investment commitment of ₹1.15 lakh crore, with projected production of ₹10.34 lakh crore and potential creation of 1.42 lakh jobs—the highest investment commitment recorded in India’s electronics sector.
Strategic Manufacturing Capabilities
The approved projects include India’s first copper clad laminate manufacturing facility. Copper clad laminate serves as the base material for multi-layer PCBs, which are currently imported. The production of polypropylene films, used in manufacturing capacitors for consumer electronics, automotive, telecommunications, and industrial equipment, will also begin domestically.
Camera modules, which are compact imaging units used across various electronic devices including smartphones, drones, laptops, medical instruments, and automotive systems, will now be manufactured within India.
Economic Implications
The government anticipates that these projects will reduce import dependence, potentially lowering product prices in the domestic market. The facilities are expected to create high-skill employment opportunities in manufacturing and research and development sectors.
The projects are also designed to establish trusted supply chains for critical sectors including defense, telecommunications, electric vehicles, and renewable energy.
The ECMS complements existing government initiatives such as the Production Linked Incentive (PLI) scheme and the India Semiconductor Mission (ISM), creating an integrated value chain from raw materials to finished electronic products.